Expanding from Core Competency in Burn-In Boards

KES offers TIU Design & Manufacturing services for its high aspect ratio board of thickness greater than 6.4mm and more than 50 layers.

All design engineering is performed in Singapore in close contact with the customers, which enables fast design turn around time. Our efforts consistently provide value added services to world class customers shorten their product development cycle and achieve faster time to market. Constant engagement in pathfinding programs helps moving towards "green" environment and developing state of art technology.

Technologies at a glance:

• High Layer Count ~ >50 layers
• High Aspect Ratio ~ > 40
• Tight Impedance Control ~ 3% tolerance
• Backdrilling ~ +/- 1 mils tolerance
• Epoxy Filling (Conductive & Non-Conductive)
• Fine pitch array ~ 0.3mm